Friday, April 29, 2016

12 layer PCB, FPGA, via in pad

90 ohm double sided impedance controlled PCB

 

Dear Sh.Manishshukla.Offer, 

Good day.

In order to obtain the ideal signal quality and transmission characteristics, high speed USB2.0 device usually requires the stacked layers of PCB is at least 4 layer. An option can be selected is Signal-GND-VCC-Signal. For a simple USB bus, it also can be designed as double sided.

 

Here's an example of 90 ohm differential impedance controlled PCB for USB.

1) FR-4 TG>130

2) 17.5um initial copper, 1.1mm finished thick

3) L1/L2 30/10 mil 90 ohm+/-10%

4) Immersion gold finish

5) Stack up

        ---------- OVERLAY (TOP)              .GTO

 ---    ---------- SOLDER MASK (TOP)          .GTS

  |     ---------- LAYER 1 (TOP LAYER)        .GTL

 1.1mm  DIELECTRIC (FR-4 core)

  |     ---------- LAYER 2 (BOTTOM LAYER)     .GBL

 ---    ---------- SOLDER MASK (BOTTOM)       .GBS

 

If you have requirement on impedance controlled PCB's, please reply back to this email or following contact by your gerber files and we will get back to you ASAP.

 

 

Kevin Liao | Business development

Bicheng PCB | www.bicheng-pcb.com | sales@bicheng-pcb.com |Material partners: ITEQ, SHENGY, TAIYO, KUANGSHUN

This message was sent to the account of Sh.Manishshukla.Offer@Blogger.Com. If you do not want to receive emails from Bicheng about marketing communications and special offers, reply as “remove” in the subject line.

 

Bicheng is located at Baoan, Shenzhen, China 518103.

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